师资队伍
首页-师资队伍-教工名录
 姓名:  余春
 职称:  副研究员
 博导/硕导:  博导
 所属二级机构:   智能化焊接与材料精密制造研究所
 通讯地址:  材料学院F楼301室
 邮编:  200240
 E-mail:  yuchun1980@sjtu.edu.cn
 联系电话:  18101853937
从事专业: 材料加工工程
学习与工作简历:

工作经历:

2019.01-至今   上海交通大学 副研究员

2009.04-2018.12 上海交通大学 助理研究院

学习经历:

2005.02-2009.03 上海交通大学 工学博士

2002.09-2005.02 江苏科技大学 工学硕士

1998.09-2002.07 江苏科技大学 学士



研究方向一 焊接界面及可靠性
研究方向二 焊接过程数值模拟
研究情况 通过设计加速试验和多尺度/多物理场模拟计算方法相结合,开展了微互连界面可靠性相关热点问题(电迁移、Kirkendall空洞)、异种材料焊接方法及界面微缺陷问题等研究。
讲授主要课程 《工程材料性能和选用》、《工程项目管理》
教学研究
代表性论文、论著

[1] Dezhi Yang, Chen Hua, Shengzhi Qu, Jijin Xu, Junmei Chen, Chun Yu*, Hao Lu*. Isothermal transformation of γ-Co to ε-Co in Stellite 6 coatings. Metallurgical and Materials Transactions A 50A (2019) 1153-1161.

[2] Qingzhao Wang, Maolong Zhang, Weihua Liu, Xiao Wei, Jijin Xu, Junmei Chen, Hao Lu*, Chun Yu*. Cr or C controlled formation of transition martensite in dissimilar metal weld. Materials Characterization 147 (2019) 434–442.

[3] Chen Hua, Hao Lu*, Chun Yu*, Junmei Chen, Maolong Zhang, Dayong Li. Reduction of Laves phase in nickel alloy welding process under ultrasonic ampere force. Journal of Materials Processing Tech 252(2018)389-397.

[4] Jijin Xu, Jingyao Chen, Chun Yu*, Yi Duan, Junmei Chen, Hao Lu*. Comparison of residual stress induced by TIG and LBW in girth weld of AISI 304 stainless steel pipes. Journal of Materials Processing Tech. 248(2017) 178-184.

[5] Qingzhao Wang, Maolong Zhang, Weihua Liu, Xiao Wei, Jijin Xu, Junmei Chen, Hao Lu*, Chun Yu*. Study of type-II boundary behavior during SA508-3EQ309L overlay weld interfacial failure process. Journal of Materials Processing Tech. 247(2017) 64-72.

[6] Chen Hua, Hao Lu, Chun Yu*, Jun-Mei Chen, Xiao Wei, Ji-jin Xu. Reduction of ductility-dip cracking susceptibility by ultrasonic-assisted GTAW. Journal of Materials Processing Technology 239 (2017) 240-250.

[7] Chun YuJieshi ChenZhewen ChengYuqian HuangJunmei ChenJijin Xu*Hao Lu*Fine grained Cu film promoting kirkendall voiding at Cu3Sn/Cu interfaceJournal of Alloys and Compounds 660 (2016) 80-84.

[8] Xiao Wei, Mengjia Xu, Qingzhao Wang, Maolong Zhang, Weihua Liu, Jijin Xu, Junmei Chen, Hao Lu*, Chun Yu*. Effect of local texture and precipitation on the ductility dip cracking of ERNiCrFe-7A Ni-based overlay. Materials and Design 110 (2016) 90-98.

[9] Jie Shi Chen, Cheng Hui Ye, Jun Mei Chen, Ji Jin Xu, Chun Yu*, Hao Lu*. Sn whiskers mitigation by refining grains of Cu substrate during the room temperature exposure. Materials Letters 161 (2015) 201-204.

[10] Jie-Shi Chen, Cheng-Hui Ye, Chun Yu*, Hao Lu*. The micro-mechanism for the effect of Sn grain orientation on substrate consumption in Sn solder joints. Computational Materials Science 108(2015) 1-7.

[11] Chun Yu, Yang Yang, Jieshi Chen, Jijin Xu, Junmei Chen, Hao Lu*. Effect of deposit thickness during electroplating on Kirkendall voiding at Sn/Cu joints. Materials Letters 128(2014) 9-11.

[12] Chun Yu, Dongye Wang, Jieshi Chen, Jijin Xu, Junmei Chen, Hao Lu*. Study of Cu6Sn5 and Cu3Sn growth behaviors by considering Trace Zn. Materials Letters 121(2014) 166-169.

[13] Chun Yu, Jieshi Chen, Kai-yun Wang, Jingqing Chen, Hao Lu*. Suppression effect of Cu and Ag on Cu3Sn layer in solder joints. Journal of Materials Science: Materials in Electronics 24(2013) 4630-4635



毕业博士生数
毕业硕士生数 4
参加学术团体、任何职务
申请专利 申请专利7项,授权发明专利3
荣誉和奖励 2010年上海市优秀博士论文,2014年上海交通大学“SMC-晨星青年学者奖励计划B)类,2016年上海交通大学优秀共产党员,上海交通大学优秀班主任。
其他
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