师资队伍
首页-师资队伍-教工名录
 姓名:  余春
 职称:  助理研究员
 博导/硕导:  
 所属二级机构:   智能化焊接与材料精密制造研究所
 通讯地址:  材料学院F楼301室
 邮编:  200240
 E-mail:  yuchun1980@sjtu.edu.cn
 联系电话:  13482283719
从事专业: 焊接
学习与工作简历:

2005.2-2009.3 上海交通大学 工学博士

2009.4至今 上海交通大学材料学院

研究方向一 微电子互连结构可靠性
研究方向二 焊接过程数值模拟
研究情况
讲授主要课程 工程材料性能和选用》、《工程项目管理》
教学研究
代表性论文、论著

代表性论文、论著*

[1] Yu, C., Yang, Y., Li, P., Chen, J., Lu, H.. Suppression of Cu 3Sn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge. Journal of Materials Science: Materials in Electronics, 2012,23(1): 56-60

[2] Yu C., Yang Y., Wang K., Xu J., Chen J., Lu H.. Relation between Kirkendall voids and intermetallic compound layers in the SnAg/Cu solder joints. Journal of Materials Science: Materials in Electronics, 2012, 23(1): 124-129.

[3] Yu C., Yang Y., Lu H., Chen J. M.. Effects of current stressing on formation and evolution of kirkendall voids at Sn-3.5Ag/Cu interface. Journal of Electronic Materials, 2010, 39(8): 1309-1314. [

4] Chun Yu, Jijin Xu, Yang Yang, Hao Lu. First principles calculation of the effects of solute atom on electromigration resistance of Al interconnects. Journal of Physics D: Applied Physics, 2009, 42: 125501.

[5] Chun Yu, Hao Lu, Shiming Li. Effect of Zn addition on the formation and growth of intermetallic compound at Sn-3.5 wt% Ag/Cu interface. Journal of Alloys and Compounds,2008, 460: 594-598.

[6] Chun Yu, Hao Lu. First-principles calculations of the effects of Cu and Ag additions on the electromigration of Sn-based solder. Journal of Applied Physics, 2007, 102: 054904.

[7] Chun Yu, Junyan Liu, Hao Lu, Peilin Li, Junmei Chen. First-principles investigation of the structural and electronic properties of Cu6-xNixSn5 (x = 0, 1, 2) intermetallic compounds. Intermetallics, 2007, 15: 1471-1478.

[8] C Yu, H Lu, R Z Fan, S M Li. Factors influencing current density distribution and current crowding in flip chip solder joints. Science and Technology of Welding and Joining, 2007, 12: 423-429.

毕业博士生数
毕业硕士生数
参加学术团体、任何职务
申请专利
荣誉和奖励 上海市优秀博士论文
其他
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