教师名录

丁冬雁

副教授
所属二级机构:电子材料与技术研究所
硕导/博导:博导
通讯地址:上海市闵行区东川路800号
电子邮箱:dyding@sjtu.edu.cn
办公电话:86-21-34202741
教育经历
  • 1990-09 ~ 1994-04    河南科技大学   材料系     本科
  • 1994-09 ~ 1997-02    河南科技大学   材料系     硕士
  • 1997-03 ~ 2000-04    哈尔滨工业大学   材料科学与工程学院     博士
工作经历
  • 2000-06 ~ 2002-05    上海交通大学材料科学与工程学院  博士后
  • 2002-06 ~ 至今    上海交通大学材料科学与工程学院  
  • 2004-09 ~ 2006-08    美国肯塔基大学电气工程系和纳米科学工程中心  高访学者研究
研究方向
  • 电子材料
  • 新能源材料与器件
研究情况

作为负责人先后承担中国博士后科学基金、国家自然科学基金、国家重大科学仪器设备开发专项课题、上海市科委人才计划项目、西门子、法液空、安集微电子和华峰铝业研发项目等,在半导体材料与集成电路、新能源材料与器件、电子可靠性、热传输材料等领域开展了诸多创新研究工作。到目前为止,在国内外学术刊物(包括Advanced Materials、Journal of The Electrochemical Society、Materials Characterization、International Journal of Hydrogen Energy、Solar Energy Materials and Solar Cells、Applied Surface Science、Electrochemistry Communications、IEEE Transactions on Components, Packaging and Manufacturing Technology、Journal of Electronic Materials、Carbon、Nanotechnology、Sensors and Actuators B、Journal of Applied Physics、Transaction of Nonferrous Metal Society of China、金属学报、复合材料学报、电池、材料导报等)发表学术论文一百余篇,论文被他人引用八百余次,发表在Nanotechnology上的三篇论文被国际纳米技术网站予以专文报道。

学术/社会兼职
  • 上海市有色金属学会  理事
  • IEEEE  会员
  • 有色金属材料与工程期刊  编委
  • 第八届电子封装技术国际会议大会  秘书长
  • 2009上海电子互连技术国际论坛  秘书长
  • 电子封装技术与高密度封装国际会议(ICEPT-HDP)封装材料与工艺分会  共同主席
  • 质量与可靠性分会  共同主席
  • 质量与可靠性分会  分会场主席
荣誉信息
  • 上海市浦江人才
  • 上海市优秀技术带头人
论文信息
  • Zhenbiao Dong, Dongyan Ding, Ting Li, Congqin Ning. High-efficiency photoelectrochemical water splitting with heterojunction photoanode of In2O3-x nanorods/black Ti-Si-O nanotubes. International Journal of Hydrogen Energy. 2019, 44(33): 17611-17621
  • Ting Li, Dongyan Ding. Photoelectrochemical water splitting with black Ni/Si-doped TiO2 nanostructures. International Journal of Hydrogen Energy, 2020, 45 (41): 20983-20992
  • Jiandi Du, Dongyan Ding, Zhou Xu, Wenlong Zhang, Yongjin Gao, Guozhen Chen, Weigao Chen, Xiaohua You, Renzong Chen, Yuanwei Huang, Jinsong Tang. Effect of Ce addition on the microstructure and properties of Al-Cu-Mn-Mg-Fe lithium battery shell alloy. Materials Characterization. 2018, 142: 252–260
  • Ting Li, Dongyan Ding. Enhanced photoelectrochemical water splitting performance of Ni/Si-doped TiO2 photoanode fabricated through electrochemical reduction in aqueous solutions. Journal of The Electrochemical Society, 2020, 167(6): 066514
  • Qiang Liu, Dongyan Ding, Ting Li, Congqin Ning, Xuewu Wang. Nonstoichiometric In2O3 nanorods/black Ti-Ni-O nanotubes heterojunction photoanode for high-efficiency photoelectrochemical water splitting. Solar Energy Materials and Solar Cells. 2016, 145(3): 382-390
  • Zhenbiao Dong, Dongyan Ding, Ting Li, Congqin Ning. Facile fabrication of Si-doped TiO2 nanotubes photoanode for enhanced photoelectrochemical hydrogen generation. Applied Surface Science 2018, 436: 125-133
  • Ting Liu, Dongyan Ding, Klaus-Peter Galuschki, Yu Hu, Yihua Gong, Ming Shen. Ni barrier induced cracks in matte Sn films. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2012, 2(5): 731-738
  • Ting Liu, Dongyan Ding, Yu Hu, Yihua Gong. Tin whisker growth on electroplated Sn multilayers. Journal of Materials Science: Materials in Electronics. 2015, 26(9): 6411-6418
  • Qiang Liu, Dongyan Ding, Congqin Ning, Xuewu Wang. Black Ni-doped TiO2 photoanodes for high-efficiency photoelectrochemical water-splitting. International Journal of Hydrogen Energy. 2015, 40: 2107-2114
  • Yeqing Tao, Dongyan Ding, Ting Li, Jason Guo, Yunhong Yu. Influence of protective atmosphere on the solderability and reliability of OSP-based solder joints. Journal of Materials Science: Materials in Electronics. 2016, 27(5): 4898-4907
  • Yeqing Tao, Dongyan Ding, Ting Li, Jason Guo, Guoliang Fan. Reflow of tiny 01005 capacitor/SAC305 solder joints in protective atmosphere. Soldering & Surface Mount Technology. 2017, 29(3): 144-150
  • Hegang Liu, Dongyan Ding, Congqin Ning, Zhaohui Li. Wide-range hydrogen sensing with Nb-doped TiO2 nanotubes. Nanotechnology. 2012, 23(1): 015502
  • Dongyan Ding, Zhi Chen. A pyrolytic carbon-stabilized, nanoporous palladium film for wide-range hydrogen sensing. Advanced Materials. 2007, 19(15): 1996-1999