教育经历
- 2008年-2012年，华东理工大学 学士
- 2013年-2015年，上海交通大学 硕士
- 2015年-2018年，早稻田大学 博士
工作经历
- 2017年-2018年，日本学术振兴会JSPS特别研究员，
- 2018年-2021年，上海交通大学材料科学与工程学院，助理教授
- 2022年-至今，上海上海交通大学材料科学与工程学院，副教授
研究方向
- 集成电路互连材料
- 三维电子封装技术
论文信息
- Sibo Zhao, Dewei Zhang, Guoxiang Cui, Xiangyu Ren, Shenghong Ju, Tao Hang, Ming Li, Y Wu*, Single atom Ru-supported reduced graphene oxide integrated self-assembled monolayer as a nm-scale Cu diffusion barrier, Nature Communications, 2025, 17, 935.
- X Ren, G Chen, P Chang, S Ju, Y Wu*，Crystal plane shielding and D-band modulation synergistically achieve durable (100) textured zinc anodes, Energy & Environmental Science, 2025, 18, 1867-1878.
- Y Li, X Ren, D Zhang, S Ju, W Hu, T Hang, M Li, Y Wu*，Dendrites-Free Zn Anode Enabled by Dense Zn Deposition and Spontaneous Texture Reconstruction on (110)- Oriented Nanotwinned Cu, Advanced Functional Materials, 2025, e14665.
- X Jin, H Li, Y Sun, Z Chen, P Chen, H Su, M Li, Y Wu*, Enhanced Reliability of Cu-Sn Bonding through the Microstructure Evolution of Nanotwinned Copper, Acta Materialia, 2025, 283, 120524.
- P Chen, W Shen, Z Chen, C Li, S Han, Y Wu*, T Hang*, M Li, Surface Atom Migration-involved Two-dimensional Nucleation and Growth of Nanotwinned Copper in DC Electrodeposition, Acta Materialia, 2023, 262, 119468.
- P Chen, C Li, S Han, T Hang, H Ling, Y Wu*, M Li, Abnormal grain growth of (110)-oriented perpendicular nanotwinned copper into ultra-large grains at low temperatures, Journal of Materials Science & Technology, 2024, 203, 61–65.
- Y Jiang, G Cui, S Zhao, X Ren, S Ju*, Y Wu*, Data-driven discovery of novel additives for superconformal cobalt electrodeposition in 3D interconnect, Chemical Engineering Journals, 2026,529,172903.
- X Jin, X Ren, G Cui, S Ju, T Hang, M Li, Y Wu*, Unveiling electron scattering mechanism at Al-doped grain boundaries in Cu interconnects, Materials & Design, 2025, 251, 113677.
- H Li, Z Liang, Z Ning, Z Liu*, M Li, Y Wu*, Low-temperature Cu-Cu direct bonding with ultra-large grains using highly (110)-oriented nanotwinned copper, Materials Characterization, 2024, 217, 114455.
- G Chen, D Zhang, X Ren, M Zhang, S Ju*, Y Wu*, Saturation absorbed sodium benzenesulfonate as crystallization modulating additive for dendrite-free Zn anode, Chemical Engineering Journal, 2024, 156868.
- X Huang, S Ma, Y Wu*, C Wan, CY Zhao, H Wang, S Ju*, High-throughput screening of amorphous polymers with high intrinsic thermal conductivity via automated physical feature engineering, Journal of Materials Chemistry A, 2023, 11 (38), 20539-20548.
- X Ren, S Zhao, F Song, S Ju,* F Wang, X Yang,* Y Wu* Anion Induced Electric Double Layer Compression and Desolvation Optimization Enable Long Life Zinc Anodes under High-Rate, Advanced Science, 2025, e13291.
- M Zhang, P Chang, P Chen, T Hang, M Li, Y Wu*, Super-flat and uni-oriented cobalt film electrodeposited by modulating the crystal nucleation and growth behavior, Applied Surface Science, 2023, 158795.、
- G Cui, Z Guo, X Ren, Y Jiang, X Jin, Y Wu*, S Ju*, Active Learning for the Discovery of Binary Intermetallic Compounds as Advanced Interconnects, JOURNAL OF PHYSICAL CHEMISTRY LETTERS, 2025, 16, 3579-3588.
- Y Wu, T Hang, H Ling, A Hu, M Li*. Review on the electrodeposition and properties of high-density chip interconnection. Sci Sin Chim, 2023, 53: 1835 1852.
社会兼职
- 上海电子学会理事
- 国际电子封装会议互连分会技术委员会委员
- 《电镀与精饰》编委
- 《电子与封装》编委
荣誉信息
- 上海交通大学优秀团员
- 2024年 第四届上海市高校教师教学创新大赛二等奖
- 2024年 上海交通大学教书育人奖三等奖
- 2023年 中国表面工程协会科学技术贡献奖‘科研之星’
- 中表镀-安美特优秀教师奖
- 上海交通大学优秀团员
- 上海市青年科技英才扬帆计划
- 日本学术振兴会研究奖励金
- 上海市优秀毕业生